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| Goal | Implementation | |------|----------------| | | A board‑level architecture that can be stacked or daisy‑chained using high‑speed PCIe‑Gen 4 or Ethernet‑based interconnects. | | Ruggedness | Conformal‑coated PCB, MIL‑STD‑810H certified enclosure, and operation temperature range –40 °C to +85 °C. | | Energy Efficiency | Dynamic voltage and frequency scaling (DVFS) together with a low‑power sleep mode that drops power consumption below 150 mW. | | Developer Friendliness | Open‑source SDK, support for Linux, Zephyr RTOS, and a lightweight hypervisor for secure partitioning. | IPZZ-286
– Hold a Phase 2 Review Meeting (23 May 2026) with product, sales, and compliance leads to present updated risk posture and timeline. This public link is valid for 7 days
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