Non-volatile NAND Flash memory, found in memory cards, smartphones, and SSDs, follows a slightly different matrix because it must account for cell types (SLC, MLC, TLC, QLC) and interface protocols (ONFI, Toggle). A common NAND part number is .
Separated by a colon ( : ), the final letter represents the manufacturing generation (die shrink) of the silicon. : First generation silicon :E : Mature, optimized silicon generation :G : Advanced sub-node generation NAND Flash Part Number Breakdown micron memory part number decoder
. For overclockers, this is the most critical part. Certain revisions, like the legendary (D-die) or Non-volatile NAND Flash memory, found in memory cards,
0.625ns clock cycle, which translates to DDR4-3200 speeds with optimized CL22 latency. -075: Corresponding to DDR4-2666 data rates. : First generation silicon :E : Mature, optimized
A short identifier (e.g., D9WDL ) found on the component.
| Part Number | Density | Organization | Speed | Package | |-------------|---------|--------------|-------|---------| | MT40A1G8SA-075E | 8Gb | x8 | DDR4-2666 | BGA | | MT40A512M16JY-083E | 8Gb | x16 | DDR4-2400 | BGA | | MT40A256M16GE-062E | 4Gb | x16 | DDR4-3200 | BGA | | MT40A2G8VA-062E | 16Gb | x8 | DDR4-3200 | BGA |
: Explains the system for flash density, interface, and operating temperature (e.g., MT29F series).