Nec B58944 Datasheet 2021

Mechanical and packaging information The datasheet includes package dimensions, land-pattern recommendations, tape-and-reel packing details for pick-and-place, and soldering profile guidelines (reflow peak temperatures and time-above-liquidus). Small SMD form factors require precise land patterns to avoid tombstoning and to ensure thermal dissipation.

Because it is an SOP-28 SMD component, replacement requires skilled surface-mount soldering techniques (hot air station recommended). nec b58944 datasheet 2021