If you are working on a specific BGA implementation, please let me know: What are your BGA components? Are you designing for a lead-free (RoHS) or leaded process? What board finish (ENIG, OSP, HASL) are you using?
Whether you are a PCB designer looking to optimize your layout or a process engineer troubleshooting assembly yields, this document is essential reading.
If you are writing a process control document, you would typically quote: "BGAs shall be assembled per IPC-7095D, Class 2, with voiding per Table 8-1."